• Cool Processing - The coolest running processor on the market
  • Cool Technology - The first processor in the world to be manufactured using leading edge 0.13 and 0.15 micron manufacturing processes, the VIA C3™ has the world's smallest x86 processor die size. This not only minimizes power consumption and heat dissipation, but also guarantees rock-solid reliability in even the most demanding environments.
     
  • Cool Performance - A rich computing and online experience
  • Cool Innovation -Enabling the creation of new generation of energy efficient Desktop PCs, Mobile PCs, High Density Servers, and Digital PC appliances
  • Cool Value - Industry benchmark for affordable Internet computing
Introduction
The VIA C3™ is the coolest processor on the market, delivering ultra low power consumption derived from its innovative design and advanced 0.13 and 0.15 micron manufacturing processes. With robust application performance, Socket 370 flexibility and rock solid reliability, the VIA C3™ processor provides a compelling solution for a complete range of desktop PC, notebook, high-density server, and Digital PC Appliance applications.
 

Cool Processing
The VIA C3™is the coolest processor on the market, saving energy and maximizing notebook battery life through its ultra low power consumption. The processor runs so cool that it can operate without a fan, making it an ideal solution for ergonomic Silent PC designs.

Cool Technology
The first processor in the world to be manufactured using a leading edge 0.13 and 0.15 micron manufacturing process. The VIA C3™ has the world's smallest x86 processor die size of as little as 52mm². This not only minimizes power consumption and heat dissipation, but also guarantees rock-solid reliability in even the most demanding environments.
Cool Performance
The VIA C3™processor, available at speeds up to 933MHz, comes packed with such advanced features as 128KB Level 1 and 64KB Level 2 cache, 100/133MHz Front Side Bus, and 3DNow!™and MMX™, to deliver cool performance for the home and business user. Complete compatibility with Microsoft Windows® and all the latest software and Internet applications ensures a rich computing and on-line experience.

Cool Innovation
Combining ultra low power consumption with full plug-in Socket 370 compatibility, the VIA C3™ processor is enabling the creation of a new wave of innovative, compact, and energy efficient desktop PCs, notebooks, servers, and Digital PC Appliances - ranging from Value PCs, Information PCs, and Set Top Boxes and a host of mobile computing devices.
Cool Value
The VIA C3™ sets the new industry benchmark for value by providing an affordable, energy efficient processor that delivers robust software and Internet application performance for the home, business and educational user. Leveraging the flexibility and cost efficiency of the standard industry Socket 370 infrastructure, the VIA C3™ brings the Internet within reach of millions more people by making PCs, notebooks, servers, and Digital PC Appliances more affordable for everyone.

The capabilities of the VIA C3™ are optimized when coupled with one of VIA's industry leading range of core logic chipsets from the award winning VIA Apollo or integrated VIA ProSavage™ ranges. Our Ultimate Value Combination pairs the VIA C3™ processor with the feature rich, fully integrated VIA Apollo PLE133
Features and Benefits Summary
 Feature Benefits
Clock Speeds up to 933MHz Robust performance for the Internet and all the latest business, personal productivity, educational, and entertainment applications.
Industry leading 0.13 and 0.15 micron manufacturing processes Enables cool processing by minimizing power consumption and heat dissipation while maximizing processor speed.
100/133MHz Front Side Bus Ensures efficient transfer of data between processor core and system memory, enabling fast system performance.
128KB L1 and 64KB L2 Cache
 		 Enhances responsiveness by delivering instant access to data used most often.
Socket 370 pinout Plug-in compatible with a complete range of Socket 370 motherboards and notebooks.
3DNow!™ and MMX™ Technology Advanced multimedia capabilities for 3D graphics and video applications.
Low Heat Dissipation Ideal for a full range of desktop and mobile solutions including fanless and enclosed designs.
Choice of PGA (Pin Grid Array), Micro PGA, and Enhanced BGA packages Flexible solutions for a complete range of desktop, mobile, server, and Digital PC appliance applications.
Ultra Low Power Consumption Saves energy costs and maximizes notebook battery life.
 

   † The information in this page is from VIA Official Website